| Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration EJ Jang, JW Kim, B Kim, T Matthias, YB Park Metals and Materials International 17, 105-109, 2011 | 47 | 2011 |
| Effects of annealing and current stressing on the intermetallic compounds growth kinetics of Cu/thin Sn/Cu bump MH Jeong, JW Kim, BH Kwak, YB Park Microelectronic Engineering 89, 50-54, 2012 | 45 | 2012 |
| Significant enhancement of antimicrobial activity in oxygen-deficient zinc oxide nanowires A Elbourne, S Cheeseman, P Wainer, J Kim, AE Medvedev, KJ Boyce, ... ACS Applied Bio Materials 3 (5), 2997-3004, 2020 | 37 | 2020 |
| Correlations between interfacial reactions and bonding strengths of Cu/Sn/Cu pillar bump BH Kwak, MH Jeong, JW Kim, B Lee, HJ Lee, YB Park Microelectronic Engineering 89, 65-69, 2012 | 33 | 2012 |
| Ultrasonic Spray Pyrolysis of Antimony‐Doped Tin Oxide Transparent Conductive Coatings J Kim, BJ Murdoch, JG Partridge, K Xing, DC Qi, J Lipton‐Duffin, ... Advanced Materials Interfaces, 2000655, 2020 | 26 | 2020 |
| Transparent electrodes based on spray coated fluorine-doped tin oxide with enhanced optical, electrical and mechanical properties J Kim, S Wong, G Kim, YB Park, J van Embden, E Della Gaspera Journal of Materials Chemistry C 8 (41), 14531-14539, 2020 | 19 | 2020 |
| Highly Conductive and Visibly Transparent p-Type CuCrO2 Films by Ultrasonic Spray Pyrolysis J Kim, O Kendall, J Ren, BJ Murdoch, CF McConville, J van Embden, ... ACS Applied Materials & Interfaces 14 (9), 11768-11778, 2022 | 17 | 2022 |
| Improvement of wafer-level Cu-to-Cu bonding quality using wet chemical pretreatment JW Kim, SJ Jeon, HJ Lee, S Hyun, YB Park Journal of Nanoscience and Nanotechnology 12 (4), 3577-3581, 2012 | 16 | 2012 |
| Effect of HF & H2SO4 pretreatment on interfacial adhesion energy of Cu–Cu direct bonds JW Kim, MH Jeong, YB Park Microelectronic engineering 89, 42-45, 2012 | 16 | 2012 |
| Characterization and observation of Cu-Cu Thermo-Compression Bonding using 4-point bending test system JW Kim, KS Kim, HJ Lee, HY Kim, YB Park, SM Hyun Journal of the Microelectronics and Packaging Society 18 (4), 11-18, 2011 | 15 | 2011 |
| Interfacial properties of Cu-Cu direct bonds for TSV integration B Kim, T Matthias, E Cakmak, EJ Jang, JW Kim, YB Park Solid State Technology 53 (8), 18-22, 2010 | 12 | 2010 |
| The effect of plasma pre-cleaning on the Cu-Cu direct bonding for 3D chip stacking. JW Kim, KS Kim, HJ Lee, H Kim, YB Park, S Hyun 18th IEEE International Symposium on the Physical and Failure Analysis of …, 2011 | 11 | 2011 |
| Effect of Forming Gas Annealing on the Interfacial Bonding Strength of Cu-Cu thermo-compression Bonded Interfaces EJ Jang, JW Kim, B Kim, T Matthias, SM Hyun, HJ Lee, YB Park Journal of the Microelectronics and Packaging Society 16 (3), 31-37, 2009 | 10 | 2009 |
| Wet Etching Characteristics of Cu Surface for Cu-Cu Pattern Direct Bonds JM Park, YR Kim, SD Kim, JW Kim, YB Park Journal of the Microelectronics and Packaging Society 19 (1), 39-45, 2012 | 8 | 2012 |
| Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection CLG Jaewon Kim, Byunghoon Lee, Ja-Myeong Koo 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017 | 6 | 2017 |
| Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate J Kim, B Lee, JY Lek, RI Made, B Salam, CL Gan 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 27-30, 2014 | 5 | 2014 |
| Effects of wet treatment conditions and pattern densities on interfacial bonding characteristics of Cu–Cu direct bonds JM Park, JW Kim, YB Park Japanese Journal of Applied Physics 53 (5S3), 05HB07, 2014 | 5 | 2014 |
| Cu thickness effects on bonding characteristics in Cu-Cu direct bonds JW Kim, MH Jeong, E Carmak, B Kim, T Matthias, HJ Lee, SM Hyun, ... Journal of the Microelectronics and Packaging Society 17 (4), 61-66, 2010 | 4 | 2010 |
| Sublimation-based wafer-scale monolayer WS 2 formation via self-limited thinning of few-layer WS 2 M Chen, J Chai, J Wu, H Zheng, WY Wu, J Lourembam, M Lin, JY Kim, ... Nanoscale Horizons 9 (1), 132-142, 2024 | 2 | 2024 |
| Strong (110) Texturing and Heteroepitaxial Growth of Thin Mo Films on MoS2 Monolayer J Kim, M Chen, WD Wang, PC Lim, J Kim, J Chai, M Zhang, SL Teo, M Lin, ... ACS Applied Electronic Materials 4 (10), 5026-5033, 2022 | 2 | 2022 |
Enrico Della GasperaAssociate Professor, RMIT UniversityVerifierad e-postadress på rmit.edu.au
