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David B. Tuckerman
David B. Tuckerman
Independent Technology Consultant
Verifierad e-postadress på alum.mit.edu
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DB Tuckerman, RFW Pease
IEEE Electron Device Letters 2, 213-213, 1981
6252*1981
High-performance heat sinking for VLSI
DB Tuckerman, RFW Pease
IEEE Electron device letters 2 (5), 126-129, 1981
62521981
HEAT-TRANSFER MICROSTRUCTURES FOR INTEGRATED CIRCUITS (COOLING, HEAT-SINK)
DB TUCKERMAN
3741984
Heat transfer in microchannels—2012 status and research needs
SG Kandlikar, S Colin, Y Peles, S Garimella, RF Pease, JJ Brandner, ...
Journal of Heat Transfer 135 (9), 091001, 2013
3452013
Optimized convective cooling using micromachined structures
DB Tuckerman, RF Pease
J. Electrochem. Soc 129 (3), C98, 1982
2341982
Chips having rear contacts connected by through vias to front contacts
B Haba, KA Honer, DB Tuckerman, V Oganesian
US Patent 8,405,196, 2013
2072013
Structure and method of making capped chips having vertical interconnects
G Humpston, D Tuckerman, B McWilliams, B Haba, C Mitchell
US Patent App. 10/949,674, 2005
2052005
Ultrahigh thermal conductance microstructures for cooling integrated circuits
DB Tuckerman, RFW Pease
IEEE-Electronics Laboratories Symposium, 145-149, 1982
1451982
Demonstration of high‐performance silicon microchannel heat exchangers for laser diode array cooling
D Mundinger, R Beach, W Benett, R Solarz, W Krupke, R Staver, ...
Applied physics letters 53 (12), 1030-1032, 1988
1171988
Packaged acoustic and electromagnetic transducer chips
G Humpston, P Osborn, J Thompson, Y Kubota, CC Tseng, R Burtzlaff, ...
US Patent App. 11/068,831, 2005
1132005
Chips having rear contacts connected by through vias to front contacts
B Haba, KA Honer, DB Tuckerman, V Oganesian
US Patent 8,310,036, 2012
942012
A Josephson ultrahigh‐resolution sampling system
DB Tuckerman
Applied Physics Letters 36 (12), 1008-1010, 1980
831980
Flexible superconducting Nb transmission lines on thin film polyimide for quantum computing applications
DB Tuckerman, MC Hamilton, DJ Reilly, R Bai, GA Hernandez, ...
Superconductor Science and Technology 29 (8), 084007, 2016
782016
Structure and method of making lidded chips
D Tuckerman, G Humpston, M Nystrom, M Beroz, J Thompson
US Patent App. 11/711,595, 2008
722008
Resonances in symmetric Josephson interferometers
DB Tuckerman, JH Magerlein
Applied Physics Letters 37 (2), 241-243, 1980
691980
Structure and method of making lidded chips
D Tuckerman, G Humpston, M Nystrom, C Goudge, A Woll
US Patent App. 11/713,804, 2008
672008
Structure and method of making lidded chips
D Tuckerman, G Humpston, M Nystrom
US Patent App. 11/711,882, 2008
632008
Back-face and edge interconnects for lidded package
R Burtzlaff, B Haba, G Humpston, D Tuckerman, M Warner, C Mitchell
US Patent App. 11/641,141, 2007
612007
Package having integral lens and wafer-scale fabrication method therefor
C De Villeneuve, G Humpston, D Tuckerman
US Patent App. 10/928,839, 2005
552005
Multichip module having SiO2 insulating layer
DB Tuckerman
US Patent 5,274,270, 1993
541993
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Artiklar 1–20