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Tiwei Wei
Tiwei Wei
Assistant Professor at Purdue University, Postdoc at Stanford University, Ph.D. in IMEC/KU Leuven
Verified email at stanford.edu - Homepage
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Year
High efficiency polymer based direct multi-jet impingement cooling solution for high power devices
Tiwei Wei, Herman Oprins, Vladimir Cherman, Jun Qian ,Ingrid De wolf, Eric ...
IEEE Transactions on Power Electronics, 1 - 1, 2018
47*2018
High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler
W Tiwei, H Oprins, V Cherman, G Van der Plas, I De Wolf, E Beyne, ...
2017 IEEE International Electron Devices Meeting (IEDM), 2017
372017
Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip
T Wei, H Oprins, V Cherman, ...
Applied Thermal Engineering 152 (https://doi.org/10.1016/j.applthermaleng …, 2019
352019
Experimental and Numerical Investigation of Direct Liquid Jet Impinging Cooling using 3D Printed Manifolds on Lidded and Lidless Packages for 2.5D Integrated Systems
Tiwei Wei, Herman Oprins, Vladimir Cherman, Eric Beyne, Matine Baelmans
Applied Thermal Engineering, 2019
33*2019
All-in-one design integrates microfluidic cooling into electronic chips
T Wei
Nature, 188-189, 2020
292020
Low-cost Energy Efficient On-chip Hotspot Targeted Microjet Cooling for High Power Electronics
Tiwei Wei, Herman Oprins, Vladimir Cherman, Eric Beyne, Matine Baelmans
IEEE Transactions on Components, Packaging and Manufacturing Technology, 1 - 1, 2019
24*2019
3D printed liquid jet impingement cooler: Demonstration, opportunities and challenges
TW Wei, H Oprins, V Cherman, I De Wolf, E Beyne, S Yang, M Baelmans
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2389-2396, 2018
232018
Experimental Characterization of a Chip Level 3D Printed Microjet Liquid Impingement Cooler for High Performance Systems
Tiwei Wei, Herman Oprins, Vladimir Cherman, Shoufeng Yang, Ingrid De wolf ...
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019
222019
Optimization and evaluation of sputtering barrier/seed layer in through silicon via for 3-D integration [J]
T Wei, J Cai, Q Wang, Y Hu, L Wang, Z Liu, Z Wu
Tsinghua Science and Technology 19 (2), 150-160, 2014
202014
Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels
Tiwei Wei, Herman Oprins, Vladimir Cherman, Eric Beyne, Matine Baelmans
Fluids 4 (3), 145, 2019
172019
Nozzle Scaling Effects for the Thermohydraulic Performance of Microjet Impingement Cooling with Distributed Returns
TW Wei, H Oprins, L Fang, V Cherman, ID Wolf, E Beyne, M Baelmans
Applied Thermal Engineering, 2020
162020
Performance and reliability study of TGV interposer in 3D integration
T Wei, Q Wang, J Cai, L Chen, J Huang, L Wang, L Zhang, C Li
2014 IEEE 16th electronics packaging technology conference (EPTC), 601-605, 2014
162014
Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler
H Chen, TW Wei, Y Chen, X Li, N Li, Q Zhu, S Hazra, Y Zhao, MP Gupta, ...
2022 IEEE Applied Power Electronics Conference and Exposition (APEC), 962-965, 2022
152022
Experimental and numerical study of 3-D printed direct jet impingement cooling for high-power, large die size applications
T Wei, H Oprins, V Cherman, Z Yang, KC Rivera, G Van der Plas, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020
122020
Numerical Study of Large Footprint (24× 24mm2) Silicon-Based Embedded Microchannel 3D Manifold Coolers
T Wei, S Hazra, Y Lin, MP Gupta, M Degner, M Asheghi, EK Goodson
Journal of Electronic Packaging 145 (2), 021008, 2023
112023
Wafer level bumping technology for high voltage LED packaging
T Wei, X Qiu, JCC Lo, SWR Lee
2015 10th International Microsystems, Packaging, Assembly and Circuits …, 2015
112015
Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling
S Hazra, T Wei, Y Lin, M Asheghi, K Goodson, MP Gupta, M Degner
International Journal of Heat and Mass Transfer 197, 123356, 2022
102022
Heat Transfer and Pressure Drop Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets
T Wei, H Oprins, LiangFang, V Cherman, E Beyne, M Baelmans
International Journal of Heat and Mass Transfer 182, 2021
102021
Copper filling process for small diameter, high aspect ratio through silicon via (TSV)
T Wei, J Cai, Q Wang, Z Liu, Y Li, T Wang, D Wang
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 …, 2012
102012
Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications
TW Wei, H Oprins, V Cherman, Z Yang, K Rivera, GV der Plas, BJ Pawlak, ...
Electronic Components and Technology Conference (ECTC), 2020
92020
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