| Hybrid CMOS rectifier based on synergistic RF-piezoelectric energy scavenging TT Nguyen, T Feng, P Häfliger, S Chakrabartty IEEE Transactions on Circuits and Systems I: Regular Papers 61 (12), 3330-3338, 2014 | 27 | 2014 |
| Feasibility of B-mode diagnostic ultrasonic energy transfer and telemetry to a cm2 sized deep-tissue implant B Fang, T Feng, M Zhang, S Chakrabartty 2015 IEEE International Symposium on Circuits and Systems (ISCAS), 782-785, 2015 | 22 | 2015 |
| Self-powered monitoring of repeated head impacts using time-dilation energy measurement circuit T Feng, K Aono, T Covassin, S Chakrabartty IEEE transactions on biomedical circuits and systems 9 (2), 217-226, 2015 | 21 | 2015 |
| Gen-2 RFID compatible, zero down-time, programmable mechanical strain-monitors and mechanical impact detectors S Chakrabartty, T Feng, K Aono Sensors and Smart Structures Technologies for Civil, Mechanical, and …, 2013 | 13 | 2013 |
| Design of a CMOS system-on-chip for passive, near-field ultrasonic energy harvesting and back-telemetry T Feng, N Lajnef, S Chakrabartty IEEE Transactions on Very Large Scale Integration (VLSI) Systems 24 (2), 544-554, 2015 | 7 | 2015 |
| Analysis and design of high efficiency inductive power-links using a novel matching strategy T Feng, S Chakrabartty 2012 IEEE 55th International Midwest Symposium on Circuits and Systems …, 2012 | 3 | 2012 |
| High-Q on-chip inductors embedded in wafer-level package for RFIC applications T Feng, J Cai, HHK Kwon, Q Wang, X Dou 2008 International Conference on Electronic Packaging Technology & High …, 2008 | 3 | 2008 |
| Sub-threshold CMOS voltage-multipliers using hybrid RF-piezoelectric energy scavenging NT Trung, T Feng, P Häfliger, S Chakrabartty 2014 IEEE Fifth International Conference on Communications and Electronics …, 2014 | 2 | 2014 |
| Design and implementation of efficient energy harvesting circuits for ultra low power and impact energy applications T Feng Michigan State University, 2016 | | 2016 |
| Simulation-Aided Thermal Design of Intermittent Power Transistor Packages Y Xiao, X Dou, J Cai, T Feng 2007 International Workshop on Electron Devices and Semiconductor Technology …, 2007 | | 2007 |
