| Recent sea ice increase and temperature decrease in the Bering Sea area, Alaska G Wendler, L Chen, B Moore Theoretical and applied climatology 117, 393-398, 2014 | 47 | 2014 |
| In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging I Khalilullah, T Reza, L Chen, AKMMH Mazumder, J Fan, C Qian, G Zhang, ... 2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017 | 39 | 2017 |
| The first decade of the new century: a cooling trend for most of Alaska G Wendler, L Chen, B Moore The Open Atmospheric Science Journal 6 (1), 2012 | 39 | 2012 |
| Design and adjustment of the graphene work function via size, modification, defects, and doping: a first-principle theory study N Yang, D Yang, L Chen, D Liu, M Cai, X Fan Nanoscale research letters 12, 1-7, 2017 | 35 | 2017 |
| Modeling nonlinear moisture diffusion in inhomogeneous media L Chen, J Zhou, H Chu, G Zhang, X Fan Microelectronics Reliability 75, 162-170, 2017 | 22 | 2017 |
| A convection–diffusion porous media model for moisture transport in polymer composites: model development and validation L Chen, HW Chu, X Fan Journal of Polymer Science Part B: Polymer Physics 53 (20), 1440-1449, 2015 | 20 | 2015 |
| GPS-based slope monitoring systems and their applications in transition mining from open-pit to underground G Chen, X Cheng, W Chen, X Li, L Chen International Journal of Mining and Mineral Engineering 5 (2), 152-163, 2014 | 20 | 2014 |
| A first-principle theoretical study of mechanical and electronic properties in graphene single-walled carbon nanotube junctions N Yang, D Yang, L Chen, D Liu, M Cai, X Fan Materials 10 (11), 1300, 2017 | 19 | 2017 |
| Modeling of moisture over-saturation and vapor pressure in die-attach film for stacked-die chip scale packages L Chen, J Adams, HW Chu, X Fan Journal of Materials Science: Materials in Electronics 27, 481-488, 2016 | 18 | 2016 |
| The effects of graphene stacking on the performance of methane sensor: A first-principles study on the adsorption, band gap and doping of graphene N Yang, D Yang, G Zhang, L Chen, D Liu, M Cai, X Fan Sensors 18 (2), 422, 2018 | 17 | 2018 |
| Investigation of impact dynamics of roof bolting with passive friction control L Chen, G Sheng, G Chen International Journal of Rock Mechanics and Mining Sciences 70, 559-568, 2014 | 14 | 2014 |
| On the modeling of surface tension and its applications by the generalized interpolation material point method L Chen, JH Lee, CF Chen Computer Modeling in Engineering and Sciences 86 (3), 199, 2012 | 14 | 2012 |
| Experimental study on the dynamic mechanical properties of titanium alloy after thermal oxidation X Niu, Y Yu, L Ma, L Chen Applied Physics A 122, 1-6, 2016 | 12 | 2016 |
| Effects of vapor pressure and super-hydrophobic nanocomposite coating on microelectronics reliability X Fan, L Chen, CP Wong, HW Chu, GQ Zhang Engineering 1 (3), 384-390, 2015 | 12 | 2015 |
| An Arrhenius-type constitutive model to predict the deformation behavior of Sn0. 3Ag0. 7Cu under different temperature X Niu, L Shen, C Chen, J Zhou, L Chen Journal of Materials Science: Materials in Electronics 30, 14611-14620, 2019 | 11 | 2019 |
| A review on water vapor pressure model for moisture permeable materials subjected to rapid heating L Chen, J Zhou, HW Chu, G Zhang, X Fan Applied Mechanics Reviews 70 (2), 020803, 2018 | 10 | 2018 |
| Die and package level thermal and thermal/moisture stresses in 3D packaging: Modeling and characterization L Chen, T Jiang, X Fan 3D Microelectronic Packaging: From Fundamentals to Applications, 293-332, 2017 | 9 | 2017 |
| Application of water activity-based theory for moisture diffusion in electronic packages using ANSYS L Chen, Y Liu, X Fan 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 8 | 2018 |
| A direct multi-field coupling methodology for modeling moisture-induced stresses and delamination in electronic packages L Chen, X Fan, Y Liu 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1064-1069, 2020 | 6 | 2020 |
| A unified and versatile model study for moisture diffusion L Chen, J Zhou, HW Chu, X Fan 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1660-1667, 2017 | 6 | 2017 |
Xuejun FanProfessor of Lamar UniversityVerifierad e-postadress på lamar.edu
