| Super-stretchable metallic interconnects on polymer with a linear strain of up to 100% Y Arafat, I Dutta, R Panat Applied Physics Letters 107 (8), 2015 | 32 | 2015 |
| A model for intermetallic growth in thin Sn joints between Cu substrates: application to solder microjoints Y Arafat, H Yang, I Dutta, PA Kumar, B Datta Journal of Electronic Materials 49, 3367-3382, 2020 | 13 | 2020 |
| On the deformation mechanisms and electrical behavior of highly stretchable metallic interconnects on elastomer substrates Y Arafat, I Dutta, R Panat Journal of Applied Physics 120 (11), 115103, 2016 | 13 | 2016 |
| Effect of Additives on the Microstructure of Electroplated Tin Films Y Arafat, ST Sultana, I Dutta, R Panat Journal of Electrochemical Society 165 (16), D816-D824, 2018 | 9 | 2018 |
| Highly stretchable metal films on polymer substrates: Mechanics and mechanisms Y Arafat, R Panat, I Dutta 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 2 | 2018 |
| Highly Stretchable Interconnects for Flexible Electronics Applications Y Arafat, R Panat, I Dutta International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015 | 1 | 2015 |
| Temperature-dependent failure of atomically thin MoTe2 ASM Haider, AFAM Hezam, MA Islam, Y Arafat, MT Ferdaous, S Salehin, ... Journal of Molecular Modeling 30 (3), 1-10, 2024 | | 2024 |
| Interfacial Effects in Highly Flexible Electronics and Thin Solder Joints for 3D Electronics Y Arafat Washington State University, 2019 | | 2019 |
Indranath DuttaWashington State UniversityVerified email at wsu.edu
