Michael D. Glover
Michael D. Glover
Verifierad e-postadress på uark.edu
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Wide bandgap technologies and their implications on miniaturizing power electronic systems
HA Mantooth, MD Glover, P Shepherd
IEEE Journal of emerging and selected topics in Power Electronics 2 (3), 374-385, 2014
1862014
Nickel–tin transient liquid phase bonding toward high-temperature operational power electronics in electrified vehicles
SW Yoon, MD Glover, K Shiozaki
IEEE Transactions on Power Electronics 28 (5), 2448-2456, 2012
1332012
Nonoperative management of the adult ruptured spleen
MR Villalba, GA Howells, RJ Lucas, JL Glover, PJ Bendick, O Tran, ...
Archives of Surgery 125 (7), 836-839, 1990
811990
A 4H silicon carbide gate buffer for integrated power systems
N Ericson, S Frank, C Britton, L Marlino, SH Ryu, D Grider, A Mantooth, ...
IEEE transactions on power electronics 29 (2), 539-542, 2013
452013
A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications
RR Lamichhane, N Ericsson, S Frank, C Britton, L Marlino, A Mantooth, ...
2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's …, 2014
442014
A solution to press-pack packaging of SiC MOSFETS
N Zhu, HA Mantooth, D Xu, M Chen, MD Glover
IEEE Transactions on Industrial Electronics 64 (10), 8224-8234, 2017
432017
Reliability of flexible thin-film embedded resistors and electrical characterization of thin-film embedded capacitors and inductors
K Fairchild, G Morcan, T Lenihan, W Brown, L Schaper, S Ang, ...
1997 Proceedings 47th Electronic Components and Technology Conference, 730-738, 1997
331997
Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles
SW Yoon, MD Glover, HA Mantooth, K Shiozaki
Journal of Micromechanics and Microengineering 23 (1), 015017, 2012
312012
Highly reliable nickel-tin transient liquid phase bonding technology for high temperature operational power electronics in electrified vehicles
SW Yoon, K Shiozaki, S Yasuda, MD Glover
2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and …, 2012
302012
Flip-chip bonded silicon carbide MOSFETs as a low parasitic alternative to wire-bonding
S Seal, MD Glover, AK Wallace, HA Mantooth
2016 IEEE 4th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2016
252016
3-D wire bondless switching cell using flip-chip-bonded silicon carbide power devices
S Seal, MD Glover, HA Mantooth
IEEE Transactions on Power Electronics 33 (10), 8553-8564, 2017
232017
High-performance and high-data-rate quasi-coaxial LTCC vertical interconnect transitions for multichip modules and system-on-package applications
E Decrossas, MD Glover, K Porter, T Cannon, T Stegeman, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (3 …, 2015
232015
A UVLO circuit in SiC compatible with power MOSFET integration
MD Glover, P Shepherd, AM Francis, M Mudholkar, HA Mantooth, ...
IEEE Journal of Emerging and Selected Topics in Power Electronics 2 (3), 425-433, 2014
222014
High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications
B Whitaker, Z Cole, B Passmore, D Martin, T McNutt, A Lostetter, ...
2014 IEEE Workshop on Wide Bandgap Power Devices and Applications, 36-40, 2014
192014
Broad frequency LTCC vertical interconnect transition for multichip modules and system on package applications
E Decrossas, MD Glover, K Porter, T Cannon, HA Mantooth, MC Hamilton
2013 European Microwave Conference, 104-107, 2013
102013
Metal layer losses in thin-film microstrip on LTCC
AD Fund, WB Kuhn, JA Wolf, RJ Eatinger, KU Porter, MD Glover, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014
92014
Integration of tantalum pentoxide capacitors with through-silicon vias
AK Tegueu, Y Liu, S Jacob, MD Glover, LW Schaper, SL Burkett
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011
72011
Flip-chip bonded SiC power devices on a low temperature co-fired ceramic (LTCC) substrate for next generation power modules
S Seal, MD Glover, HA Mantooth
Additional Papers and Presentations 2016 (HiTEC), 000159-000168, 2016
52016
Nanosilver preform assisted die attach for high temperature applications
S Seal, MD Glover, HA Mantooth
2015 IEEE Applied Power Electronics Conference and Exposition (APEC), 2925-2930, 2015
52015
An integrated gate driver in 4H-SiC for power converter applications
MN Ericson, SS Frank, CL Britton, LD Marlino, DD Janke, DB Ezell, ...
2014 IEEE Workshop on Wide Bandgap Power Devices and Applications, 66-69, 2014
52014
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Artiklar 1–20