| A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering A Kunwar, L An, J Liu, S Shang, P Råback, H Ma, X Song Journal of Materials Science & Technology 50, 115-127, 2020 | 37 | 2020 |
| Synthesis of Cu@ Ag core–shell nanoparticles for characterization of thermal stability and electric resistivity S Shang, A Kunwar, Y Wang, X Qi, H Ma, Y Wang Applied Physics A 124, 1-8, 2018 | 37 | 2018 |
| Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5 Ag0. 5/Cu joints A Kunwar, S Shang, P Råback, Y Wang, J Givernaud, J Chen, H Ma, ... Microelectronics Reliability 80, 55-67, 2018 | 36 | 2018 |
| Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows HR Ma, A Kunwar, SY Shang, CR Jiang, YP Wang, HT Ma, N Zhao Intermetallics 96, 1-12, 2018 | 25 | 2018 |
| Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling A Kunwar, B Guo, S Shang, P Råback, Y Wang, J Chen, H Ma, X Song, ... Intermetallics 93, 186-196, 2018 | 21 | 2018 |
| Electrochemical migration behavior of Sn-based lead-free solder X Qi, H Ma, C Wang, S Shang, X Li, Y Wang, H Ma Journal of Materials Science: Materials in Electronics 30, 14695-14702, 2019 | 18 | 2019 |
| Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint S Shang, Y Wang, Y Wang, H Ma, A Kunwar Microelectronic Engineering 208, 47-53, 2019 | 17 | 2019 |
| Formation of nanoporous anodized tin oxide films in electrolyte containing F− and S2− J Cao, C Wang, Z Gao, S Shang, Q Gu, N Gao, Y Wang, H Ma ECS Journal of Solid State Science and Technology 9 (10), 104010, 2020 | 13 | 2020 |
| Size effect on interface reaction of Sn–xCu/Cu solder joints during multiple reflows R Huang, H Ma, S Shang, A Kunwar, Y Wang, H Ma Journal of Materials Science: Materials in Electronics 30, 4359-4369, 2019 | 13 | 2019 |
| Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn–xCu solders during multiple reflows H Ma, H Ma, A Kunwar, S Shang, Y Wang, J Chen, M Huang, N Zhao Journal of Materials Science: Materials in Electronics 29, 602-613, 2018 | 13 | 2018 |
| Effect of the Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints S Shang, A Kunwar, J Yao, Y Wang, H Ma, Y Wang Metals and Materials International 25 (2), 499-507, 2019 | 12 | 2019 |
| Geometrical effects of Cu@ Ag core–shell nanoparticles treated flux on the growth behaviour of intermetallics in Sn/Cu solder joints S Shang, A Kunwar, Y Wang, J Yao, Y Wu, H Ma, Y Wang Electronic Materials Letters 15, 253-265, 2019 | 9 | 2019 |
| Pronounced electromigration of GaInSn/Cu interconnects under super low critical current density Z Gao, C Dong, S Shang, M Huang, H Ma, Y Wang Materials Letters 300, 130137, 2021 | 7 | 2021 |
| Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface S Shang, A Kunwar, Y Wang, L Qu, H Ma, Y Wang Journal of Materials Science: Materials in Electronics 30, 2872-2887, 2019 | 7 | 2019 |
| Modelling the melting of Sn0. 7Cu solder using the enthalpy method A Kunwar, J Givernaud, H Ma, Z Meng, S Shang, Y Wang, H Ma 2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016 | 7 | 2016 |
| Effects of TiO2 nanoparticles addition on physical and soldering properties of Sn–xTiO2 composite solder Z Liu, H Ma, S Shang, Y Wang, X Li, H Ma Journal of Materials Science: Materials in Electronics 30, 18828-18837, 2019 | 6 | 2019 |
| Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface Z Zhu, H Ma, S Shang, H Ma, Y Wang, X Li Journal of Materials Science: Materials in Electronics 30, 15964-15971, 2019 | 6 | 2019 |
| Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux S Shang, A Kunwar, J Yao, H Ma, Y Wang Thin Solid Films 669, 198-207, 2019 | 6 | 2019 |
| All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles S Shang, A Kunwar, J Yao, Y Wang, N Zhao, M Huang, H Ma Journal of Materials Science: Materials in Electronics 29, 15966-15972, 2018 | 4 | 2018 |
| Effects of Cu nanoparticles doped flux on the microstructure of IMCs between Sn solder and Cu substrate S Shang, A Kunwar, Y Wu, H Ma 2017 18th International Conference on Electronic Packaging Technology (ICEPT …, 2017 | 3 | 2017 |
Anil KunwarSilesian University of TechnologyVerified email at polsl.pl
