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Co-authors
Xianming QingInstitute for Infocomm ResearchVerified email at i2r.a-star.edu.sg- michael yan wah chiaIEEEVerified email at ieee.org
- MAX AMMANNTechnological University DublinVerified email at dit.ie
- Cheng-Wei QIUDepartment of Electrical and Computer Engineering, National University of SingaporeVerified email at nus.edu.sg
- Ning YangNovAtel Inc. CalgaryVerified email at novatel.com
- Junfeng XuMITVerified email at mit.edu
- Wei LiuResearch Fellow, Department of Electrical & Computer Engineering, National University of SingaporeVerified email at nus.edu.sg
- mei sunInstitute for Infocomm ResearchVerified email at i2r.a-star.edu.sg
- Joshua LW LiProfessor of Electrical & Computer Systems Engineering, Monash UniversityVerified email at monash.edu
- Amin KianinejadNational University of SingaporeVerified email at u.nus.edu
- Wee Kian TohMicrosoft CorporationVerified email at ieee.org
- Feng Han LIN (林丰涵)ShanghaiTech UniversityVerified email at shanghaitech.edu.cn
- Kwai Man LukProfessor of Electronic Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Baowen LiRennie Family Endowed Professor, Mechanical Engineering, University of Colorado, BoulderVerified email at Colorado.Edu
- Thomas ZwickProfessor at Karlsruhe Institute of TechnologyVerified email at kit.edu
- Kazuhiro HirasawaVerified email at ieee.org
- Teng LiSoutheast UniversityVerified email at ieee.org
- Sai-Wai Wong 王世伟Shenzhen University深圳大学Verified email at szu.edu.cn
- Brian GaucherIBMVerified email at us.ibm.com
- Yunjia ZengInstitute for Infocomm ResearchVerified email at i2r.a-star.edu.sg
