Xiaowu Zhang
Xiaowu Zhang
institute of microelectronics
Verifierad e-postadress på ime.a-star.edu.sg
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Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps
CS Selvanayagam, JH Lau, X Zhang, SKW Seah, K Vaidyanathan, ...
IEEE Transactions on Advanced Packaging 32 (4), 720-728, 2009
3392009
Development of 3-D silicon module with TSV for system in packaging
N Khan, VS Rao, S Lim, HS We, V Lee, X Zhang, EB Liao, R Nagarajan, ...
IEEE Transactions on Components and Packaging Technologies 33 (1), 3-9, 2010
1742010
The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures
FX Che, WH Zhu, ESW Poh, XW Zhang, XR Zhang
Journal of Alloys and Compounds 507 (1), 215-224, 2010
1452010
Development of through silicon via (TSV) interposer technology for large die (21× 21mm) fine-pitch Cu/low-k FCBGA package
X Zhang, TC Chai, JH Lau, CS Selvanayagam, K Biswas, S Liu, D Pinjala, ...
2009 59th Electronic components and technology conference, 305-312, 2009
1152009
High-density 3D-boron nitride and 3D-graphene for high-performance nano–thermal interface material
M Loeblein, SH Tsang, M Pawlik, EJR Phua, H Yong, XW Zhang, CL Gan, ...
ACS nano 11 (2), 2033-2044, 2017
792017
Electromigration performance of Through Silicon Via (TSV)–A modeling approach
YC Tan, CM Tan, XW Zhang, TC Chai, DQ Yu
Microelectronics Reliability 50 (9-11), 1336-1340, 2010
742010
Study on Cu protrusion of through-silicon via
FX Che, WN Putra, A Heryanto, A Trigg, X Zhang, CL Gan
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (5 …, 2013
712013
TSV interposer fabrication for 3D IC packaging
VS Rao, HS Wee, LWS Vincent, LH Yu, L Ebin, R Nagarajan, CT Chong, ...
2009 11th Electronics Packaging Technology Conference, 431-437, 2009
702009
Heterogeneous 2.5 D integration on through silicon interposer
X Zhang, JK Lin, S Wickramanayaka, S Zhang, R Weerasekera, R Dutta, ...
Applied Physics Reviews 2 (2), 021308, 2015
652015
Modeling and design solutions to overcome warpage challenge for fan-out wafer level packaging (FO-WLP) technology
FX Che, D Ho, MZ Ding, X Zhang
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-8, 2015
552015
Modeling stress in silicon with TSVs and its effect on mobility
C Selvanayagam, X Zhang, R Rajoo, D Pinjala
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (9 …, 2011
522011
Thermo-mechanical finite element analysis in a multichip build up substrate based package design
X Zhang, EH Wong, C Lee, TC Chai, Y Ma, PS Teo, D Pinjala, S Sampath
Microelectronics Reliability 44 (4), 611-619, 2004
492004
Effect of TSV interposer on the thermal performance of FCBGA package
YYG Hoe, TG Yue, P Damaruganath, CT Chong, JH Lau, Z Xiaowu, ...
2009 11th Electronics Packaging Technology Conference, 778-786, 2009
472009
Design and development of a multi-die embedded micro wafer level package
V Kripesh, VS Rao, A Kumar, G Sharma, KC Houe, Z Xiaowu, KY Mong, ...
2008 58th Electronic Components and Technology Conference, 1544-1549, 2008
472008
A novel method to predict die shift during compression molding in embedded wafer level package
CH Khong, A Kumar, X Zhang, G Sharma, SR Vempati, K Vaidyanathan, ...
2009 59th Electronic Components and Technology Conference, 535-541, 2009
442009
A damage evolution model for thermal fatigue analysis of solder joints
X Zhang, SWR Lee, YH Pao
J. Electron. Packag. 122 (3), 200-206, 2000
442000
Development of Large Die Fine-Pitch Cu/Low-FCBGA Package With Through Silicon via (TSV) Interposer
TC Chai, X Zhang, JH Lau, CS Selvanayagam, P Damaruganath, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (5 …, 2011
402011
Application of piezoresistive stress sensors in ultra thin device handling and characterization
X Zhang, A Kumar, QX Zhang, YY Ong, SW Ho, CH Khong, V Kripesh, ...
Sensors and Actuators A: Physical 156 (1), 2-7, 2009
382009
Development of wafer-level warpage and stress modeling methodology and its application in process optimization for TSV wafers
F Che, HY Li, X Zhang, S Gao, KH Teo
IEEE transactions on components, packaging and manufacturing technology 2 (6 …, 2012
362012
Board level solder joint failures by static and dynamic loads
LB Tan, SKW Seah, EH Wong, X Zhang, VBC Tan, CT Lim
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC …, 2003
352003
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Artiklar 1–20