| New three-dimensional integration technology using self-assembly technique T Fukushima, Y Yamada, H Kikuchi, M Koyanagi IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest …, 2005 | 163 | 2005 |
| New three-dimensional integration technology based on reconfigured wafer-on-wafer bonding technique T Fukushima, H Kikuchi, Y Yamada, T Konno, J Liang, K Sasaki, ... 2007 IEEE International Electron Devices Meeting, 985-988, 2007 | 121 | 2007 |
| Component action of nilpotent multiplet coupled to matter in 4 dimensional supergravity F Hasegawa, Y Yamada Journal of High Energy Physics 2015 (10), 1-14, 2015 | 102 | 2015 |
| Tungsten through-silicon via technology for three-dimensional LSIs H Kikuchi, Y Yamada, AM Ali, J Liang, T Fukushima, T Tanaka, ... Japanese Journal of Applied Physics 47 (4S), 2801, 2008 | 86 | 2008 |
| New three-dimensional integration technology using chip-to-wafer bonding to achieve ultimate super-chip integration T Fukushima, Y Yamada, H Kikuchi, M Koyanagi Japanese Journal of Applied Physics 45 (4S), 3030, 2006 | 82 | 2006 |
| induced geometric inflation R Kallosh, A Linde, D Roest, Y Yamada Journal of High Energy Physics 2017 (7), 1-22, 2017 | 67 | 2017 |
| Maximal supersymmetry and B-mode targets R Kallosh, A Linde, T Wrase, Y Yamada Journal of High Energy Physics 2017 (4), 1-30, 2017 | 66 | 2017 |
| System in wafer-level package technology with RDL-first process N Motohashi, T Kimura, K Mineo, Y Yamada, T Nishiyama, K Shibuya, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 59-64, 2011 | 57 | 2011 |
| High-resolution long-array thermal ink jet printhead fabricated by anisotropic wet etching and deep Si RIE R Nayve, M Fujii, A Fukugawa, T Takeuchi, M Murata, Y Yamada, ... Journal of microelectromechanical systems 13 (5), 814-821, 2004 | 57 | 2004 |
| Hypernatural inflation A Linde, DG Wang, Y Welling, Y Yamada, A Achúcarro Journal of Cosmology and Astroparticle Physics 2018 (07), 035, 2018 | 56 | 2018 |
| Reheating processes after Starobinsky inflation in old-minimal supergravity T Terada, Y Watanabe, Y Yamada, J Yokoyama Journal of High Energy Physics 2015 (2), 1-26, 2015 | 51 | 2015 |
| Supersymmetric anti-D3-brane action in the Kachru-Kallosh-Linde-Trivedi setup N Cribiori, C Roupec, T Wrase, Y Yamada Physical Review D 100 (6), 066001, 2019 | 46 | 2019 |
| Supersymmetric anti-D3-brane action in the Kachru-Kallosh-Linde-Trivedi setup N Cribiori, C Roupec, T Wrase, Y Yamada Physical Review D 100 (6), 066001, 2019 | 46 | 2019 |
| Fibre Inflation and α-attractors R Kallosh, A Linde, D Roest, A Westphal, Y Yamada Journal of High Energy Physics 2018 (2), 1-24, 2018 | 39 | 2018 |
| Self-assembly process for chip-to-wafer three-dimensional integration T Fukushima, Y Yamada, H Kikuchi, T Tanaka, M Koyanagi 2007 Proceedings 57th Electronic Components and Technology Conference, 836-841, 2007 | 38 | 2007 |
| Gravitino problem in minimal supergravity inflation F Hasegawa, K Mukaida, K Nakayama, T Terada, Y Yamada Physics Letters B 767, 392-397, 2017 | 33 | 2017 |
| Planck 2018 and brane inflation revisited R Kallosh, A Linde, Y Yamada Journal of High Energy Physics 2019 (1), 1-28, 2019 | 29 | 2019 |
| Ghostbusters in higher derivative supersymmetric theories: who is afraid of propagating auxiliary fields? T Fujimori, M Nitta, Y Yamada Journal of High Energy Physics 2016 (9), 1-16, 2016 | 25 | 2016 |
| Inflation in supergravity without Kähler potential S Aoki, Y Yamada Physical Review D 90 (12), 127701, 2014 | 25 | 2014 |
| Absence of U(1) anomalous superamplitudes in ≥ 5 supergravities DZ Freedman, R Kallosh, D Murli, A Van Proeyen, Y Yamada Journal of High Energy Physics 2017 (5), 1-30, 2017 | 22 | 2017 |
