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Co-authors
Zhi DingDistinguished Professor of Electrical and Computer Engineering, University of California DavisVerified email at ucdavis.edu
Jiangang ShenThe University of Hong KongVerified email at hkucc.hku.hk
Li-Hai TanDirector, Shenzhen Institute of Neuroscience (SION), Shenzhen, ChinaVerified email at sions.cn
Edmund LamProfessor, Associate Dean of Engineering, at University of Hong KongVerified email at eee.hku.hk
Shing Chun Benny LamUniversity of Hong Kong, University of Southampton, Janelia Farm, University of PennsylvaniaVerified email at mail.med.upenn.edu
WW LuProfessor of Dept of orthopaedics, the university of Hong KongVerified email at hku.hk
Wai Ting SiokUniversity of Hong KongVerified email at hku.hk
K.T. ChauThe University of Hong KongVerified email at eee.hku.hk
Jianchao YaoMerck, Senior Scientist, Computational Genomics & GeneticsVerified email at merck.com
Ann LoraineUniversity of North Carolina at CharlotteVerified email at uncc.edu
Hing Cheung SoCity University of Hong KongVerified email at ee.cityu.edu.hk
Mahesan NiranjanUniversity of SouthamptonVerified email at ecs.soton.ac.uk
C.Q. Chang
Professor, School of Biomedical Engineering, Shenzhen University
Verified email at szu.edu.cn